Integrated Circuit Structure Having Dies with Connectors

摘要

An embodiment is an integrated circuit structure including a first die having a bump structure, and a second die having a pad structure. The first die is attached to the second die by bonding the bump structure and the pad structure. The bump structure includes a metal pillar, a metal cap layer on the metal pillar, a metal insertion layer on the metal cap layer, and a solder layer on the metal insertion layer. The pad structure includes at least one of a nickel (Ni) layer, a palladium (Pd) layer or a gold (Au) layer.

主权项

1. A method comprising:
forming a conductive interconnect over a first die; depositing a conductive pillar having a first conductive material over the conductive interconnect, the conductive pillar being electrically coupled to the conductive interconnect; depositing a first cap layer on the conductive pillar, the first cap layer having a different material composition than the conductive pillar; depositing a second cap layer having the first conductive material on the first cap layer, the second cap layer having a different material composition than the first cap layer; and forming a solder layer on the second cap layer.