Decoupling apparatus 10 for a microcircuit 12 provides for a custom capacitor 20 to be placed directly on the passivated upper surface 11 of the integrated circuit or alternatively to be placed directly under the integrated circuit. In another alternative, multiple standard chip capacitors are placed directly on the passivated upper surface and connected by wire bonds to metal bars also resting on the upper surface. <IMAGE>
申请公布号
DE69126115(D1)
申请公布日期
1997.06.19
申请号
DE1991626115
申请日期
1991.12.24
申请人
SAMSUNG ELECTRONICS CO., LTD., SEOUL/SOUL, KR
发明人
DUNAWAY, THOMAS J., MINNESOTA 55416, US;SPIELBERGER, RICHARD, MINNESOTA 55369, US;HEINKS, MICHAEL W., MINNESOTA 55369, US