发明名称 TEAR-AWAY PACKAGE OPENING
摘要 <p>A package (10) comprising an outer substrate layer, an inner aseptic layer secured to the outer substrate layer, and a cut (40) in the outer substrate layer forming a tear-away opening. The cut does not puncture the inner aseptic layer, but it is sufficiently deep so that part of the package may be torn off. A method for manufacturing the package includes providing an outer substrate layer, securing an inner aseptic layer to the outer substrate layer, making a cut of predetermined depth in the outer substrate layer that does not puncture the inner aseptic layer, and then forming a package. The method for opening the package includes extending a flap (60) from a side of the package, extending at least a portion of a joint (70) from the top and the flap, and moving at leat a portion of the top (50) upwardly, and tearing away a portion of the package.</p>
申请公布号 WO1998045175(A2) 申请公布日期 1998.10.15
申请号 US1998006759 申请日期 1998.04.03
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