| 摘要 |
<p>The invention concerns a method for inserting an electronic module (13) on a thermoplastic substrate (131) in a cavity (12) provided in a card with electronic memory in thermoplastic material. The invention is characterised in that it consists in the following steps: a) depositing in said cavity (12) an adhesive (14) for gluing the electronic module (13) thermoplastic substrate (131) on the card body (11) thermoplastic material; b) arranging the electronic module (13) in the cavity (12); c) simultaneously applying a pressing force (F) on the electronic module (13) and ultrasonic energy (US) on the cavity (12) thermoplastic material, in contact with the electronic module (13) thermoplastic substrate (131). The invention is useful for making cards with electronic memory.</p> |
