发明名称 METHOD AND DEVICE FOR SOLDERING
摘要 PROBLEM TO BE SOLVED: To provide a soldering method with which defective soldering can be found, the place of the defective soldering can be removed and resoldering can be carried out in an automatic production process. SOLUTION: In the soldering method with which a soldering wire 1 is fed toward joining portions 9, the tip part 1a of the soldering wire 1 is melted by generating an arc 3a between an electrode 2a for joining, which is arranged near the tip part 1a of the soldering wire 1 and the tip part 1a of the soldering wire 1 and the above molten metal droplet 4 dropped on the joining portions 9 is solidified, when the acceptable or nonacceptable of the sticking state of solder 8 in the joining portions 9, has been confirmed and when the soldering has been judged to be defective, the defective solder is melted by generating an arc between the above electrode 2a for joining and an electrode 31 for removing, successively the melted solder is removed and after that, the joining portions 9 are resoldered.
申请公布号 JP2002028774(A) 申请公布日期 2002.01.29
申请号 JP20000208840 申请日期 2000.07.10
申请人 OMC KK 发明人 WATANABE SHINJI
分类号 B23K1/00;H05K3/34;(IPC1-7):B23K1/00 主分类号 B23K1/00
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