| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic wiring board which can avoid the formation of a rough surface of a substrate even when laminated by a multiplicity of sheets of ceramic tape, and can reduce the generation of bleeding or the like when printing is carried out on its outermost layer. SOLUTION: By providing a second ceramic tape 4 that can bury a conductor 3 on a ceramic tape 1 upon baking between the ceramic tapes 1 each having a conductor 3 printed thereon, the ceramic tapes 1 are laminated and then baked to be formed integrally. |
