发明名称 Method and apparatus for transferring wafers from wafer carrier to wafer conveyor apparatus in carrierless wafer surface treatment apparatus
摘要 A method of taking out and transferring a plurality of wafers from each of a plurality of wafer carriers to a wafer conveyor robot includes the steps of taking out wafer groups inside the wafer carriers from respective wafer carriers and aligning the same on a straight line with respective wafer groups being spaced apart, shifting at least one of the wafer groups so that an interval between the spaced wafer groups becomes equal to intervals among the wafers in each of wafer groups, and holding the shifted wafer groups with the wafer conveyor robot. An apparatus for practicing this method is also disclosed.
申请公布号 US5269643(A) 申请公布日期 1993.12.14
申请号 US19920856099 申请日期 1992.03.23
申请人 DANIPPON SCREEN MANUFACTURING CO., LTD. 发明人 KODAMA, SHUNSAKU;SHIMA, YASUMASA;KOHARA, SHIGERU;OHASHI, YASUHIKO
分类号 H01L21/30;B65G49/07;H01L21/027;H01L21/304;H01L21/306;H01L21/677;(IPC1-7):B65G49/07 主分类号 H01L21/30
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