发明名称 |
INSPECTION EQUIPMENT OF SEMICONDUCTOR DEVICE AND DAM BAR CUTTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To obtain an inspection equipment and a dam bar cutting device which are capable of accurately measuring the number and width of the cut dam bars of a semiconductor device so as to quickly detect cutting failures even if dam bars to cut are changed in dimensions with the change of a semiconductor device in type and size. SOLUTION: After dam bars are cut off, rectangular wave signals T corresponding to the width of the cut part of the dam bar are generated from a comparator 14, the number of pulses of pulse signals sent from an encoder 10a is counted in the rise time of the rectangular wave signals T through a counter circuit, and the number of counts is compared with a certain value based on a design value through a quality judging circuit. By this setup, trouble as to the cutting of a dam bar can be quickly detected. |
申请公布号 |
JPH09213858(A) |
申请公布日期 |
1997.08.15 |
申请号 |
JP19960019802 |
申请日期 |
1996.02.06 |
申请人 |
HITACHI CONSTR MACH CO LTD |
发明人 |
NAGANO YOSHIYA;MITSUYANAGI NAOKI;SHIRAI TAKASHI;SHIMOMURA YOSHIAKI;OKUMURA SHINYA;SAKURAI SHIGEYUKI;MINOMOTO YASUSHI |
分类号 |
G01B11/24;B23K26/00;B23K26/08;H01L21/66;H01L23/50 |
主分类号 |
G01B11/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|