| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting frame for coping with the function diversification, use diversification and miniaturization of an electronic equipment. SOLUTION: A semiconductor element mounting board 13 for mounting this frame is provided with a first and an second inner side leads 27 and 28 respectively on the front and back of a first insulation sheet member 21. Further, on a first circuit board 19 for which the prescribed first and the second inner leads 27 and 28 are connected through through-holes 31, 32, 32a, 33, 34 and 34a formed on the first insulation sheet member 21 and the prescribed second inner side lead 28 is provided with a first connection terminal land 35, an opening part 37 for exposing a second bonding area 30 is provided on a center part. Further, a second circuit board 20 whose main body is a second insulation sheet member 36 provided with side rails on both side parts provided with a conducting part to be electrically connected to the first connection terminal land finally and provided with a second connection terminal land 40 conducted to the conducting part on a back surface side is joined.</p> |
