| 摘要 |
The present invention relates to a substrate bonding apparatus used for bonding a substrate and a film so as to reduce a defect rate of the substrate by increasing adhesion between the substrate and the film bonded to the substrate. The substrate bonding apparatus comprises: a substrate supply unit for supplying a substrate; a film supply unit for supplying a film attached to the substrate; an outer press roll to attach the film to the substrate; and an inner press roll formed inside the outer press roll, and transferring the outer press roll. |
