| 摘要 |
<p>PURPOSE:To improve the reliabilities in crack resistance and humidity resistance simultaneously with an excellent balance between them, by compounding PPS resin with aromatic polysulfone resin. CONSTITUTION:The title resin composition for sealing a semiconductor is so prepared as to contain 0.01-5pts. of an organic third phosphine compound and 20-250pts. of an inorganic filler, in the weight ratio, in relation to 100pts. of a compound of PPS resin of 99-50% with aromatic polysulfone resin of 1-50%. The rate of use of the aromatic polysulfone resin is 1-50%, preferably 5-30%, in the weight ratio in relation to 99-50% of the PPS resin. When the rate exceeds 50%, the injection molding of the resin composition of the present invention is hard to conduct, while the crack resistance of the resin composition lowers when it is below 1%.</p> |
