| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain distortion generation or the like due to solder connection of outer connection terminals, make it hard to generate fatique breakdown in connection parts, and enable connection mounting of high reliability, by collectively arranging an expansion relieving layer insulated from outer connection terminals, on the surface of a board surface on which the outer connection terminals are led. SOLUTION: A semiconductor package has a substrate 10 wherein outer connection terminals 10a are arranged on the main surface, and a semiconductor device 11 which is made to correspond to connection terminals 10b of the substrate 10, and electrically connected and mounted. The substrate 10 is an alumina substrate. The device 11 is an IC chip, and connected and fixed to a specific position of the alumina substrate 10 surface bay face down. Connection parts or the like of the device 11 is sealed with a resin layer 12. Conductor bumps 13 are arranged on the surfaces of the outer connection terminals 10a. Electrically insulating from the outer connection terminals 10a and the conductor bumps 13, an expansion relieving layer 14 of the substrate 10 is collectively formed can the alumina substrate 10 surface. A semiconductor package 10 is mounted on a wiring board.</p> |
