| 摘要 |
PROBLEM TO BE SOLVED: To obtain a fully molded semiconductor device, comprising a series connection circuit using a conventional lead frame or an improved lead frame. SOLUTION: The series connection circuit is formed by using two planar- structure semiconductor elements 5A, 5B, and the conventional lead frame 1 for a full-wave rectifying bridge circuit or the improved lead frame 11 is used. In the lead frame 11, an expanded width part 9A is formed in an external cathode lead 9B arranged at the center, and since the fully molded semiconductor device comprising the series connection circuit can be manufactured, a first lead terminal 3C will not become unoccupied, a current route becomes relatively short, a current balance takes a nearly symmetrical shape, and the offset of an L portion can be expected.
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