发明名称 ADVANCED MODULAR CELL PLACEMENT SYSTEM WITH OVERLAP REMOVER WITH MINIMAL NOISE
摘要 A method for refining the position of linearly aligned cells on the surface of a semiconductor chip is disclosed herein. The method comprises defining an array of spaces between cells based on maximum and minimum cell positions, establishing a minimum spacing between cells, and linearly shifting cells in a predetermined manner such that no cells are closer to one another than the miminum spacing between cells. The system further increases the size associated with each cell by a fixed amount. The system then performs various density equalization routines to all cells, and locates cells having a size greater than a predetermined quantity and fixes those cells. Finally, the system executes a plurality of optimal cell movement routines to crystallize cell placement.
申请公布号 WO9800800(A2) 申请公布日期 1998.01.08
申请号 WO1997US11100 申请日期 1997.06.26
申请人 LSI LOGIC CORPORATION 发明人 SCEPANOVIC, RANKO;KOFORD, JAMES, S.;ANDREEV, ALEXANDER E.
分类号 G06F17/50 主分类号 G06F17/50
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