发明名称 |
ADVANCED MODULAR CELL PLACEMENT SYSTEM WITH OVERLAP REMOVER WITH MINIMAL NOISE |
摘要 |
A method for refining the position of linearly aligned cells on the surface of a semiconductor chip is disclosed herein. The method comprises defining an array of spaces between cells based on maximum and minimum cell positions, establishing a minimum spacing between cells, and linearly shifting cells in a predetermined manner such that no cells are closer to one another than the miminum spacing between cells. The system further increases the size associated with each cell by a fixed amount. The system then performs various density equalization routines to all cells, and locates cells having a size greater than a predetermined quantity and fixes those cells. Finally, the system executes a plurality of optimal cell movement routines to crystallize cell placement. |
申请公布号 |
WO9800800(A2) |
申请公布日期 |
1998.01.08 |
申请号 |
WO1997US11100 |
申请日期 |
1997.06.26 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
SCEPANOVIC, RANKO;KOFORD, JAMES, S.;ANDREEV, ALEXANDER E. |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|