A probe assembly comprises a probe base plate with a plurality of probes to be used for electrical inspection of a plurality of semiconductor chip regions continuously formed in alignment in the directions orthogonal to each other on a substantially circular semiconductor wafer, and capable of contacting the electrical connecting portions of each semiconductor chip region. The tips of a plurality of probe groups are arranged in the X and Y directions orthogonal to each other on the surface of the probe base plate in correspondence to predetermined chip region groups including the predetermined number of semiconductor chip regions. The arrangement regions of the probe groups are formed discontinuously in both of the X and Y directions. The relative feeding movement of the semiconductor wafer in either of the X and Y directions enables the electrical inspection of all the chip region groups on the semiconductor wafer.
