| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which inhibits a decrease in thickness of an end of an insulating resin sheet.SOLUTION: In a power module in which a heat dissipation member 13, an insulating resin sheet 14 and a thermal conductive member 15 are sequentially joined to at least one principal surface of a semiconductor element 10 and the semiconductor element 10, the heat dissipation member 13, the insulating resin sheet 14 and the thermal conductive member 15 are encapsulated, a lateral face of at least either of the heat dissipation member 13 or the thermal conductive member 15 is shaped into a forward tapered shape tapered from a surface contacting the insulating resin sheet 14 toward a surface opposite to the contacting surface.SELECTED DRAWING: Figure 1 |
