| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to apply to a high frequency analog circuit and digital/high frequency analog mixed mounting circuit having excellent characteristics and reliability by a method wherein the transmission loss of the electric signal of a multilayer wiring, which constitutes an electronic device, is brought to the specific value or lower, and a heat-resisting temperature is set at a specific temperature or higher. SOLUTION: The material, having the transmission loss of electric signal of 0.04dB/GHz or smaller per 1cm and the heat-resisting temperature of 180 deg.C or higher, is used for the multiwiring plate 1 of an electric device provided with a multilayer wiring plate 1 and an electronic element 4. An IC chip 3 is arranged on the center part of one surface of the multiwiring plate 1, the electronic elements 4 other than the IC chip are arranged on the circumferential part, and after they have been fixed on a conductive wiring 2, they are sealed by molding resin 5. As a result, not only a signal to noise ratio is improved, but also the distortion of waveshape of the signal, which becomes the problem when a high frequency signal is treated, becomes small. Also, the characteristics of the electronic device are very hard to change by the change of temperature. |
