发明名称 PULSED HEATING TOOL
摘要 PURPOSE:To provide a pulsed heating tool for thermocompression bonding by an inner lead bonder for bonding a bump electrode of a semiconductor pellet and an inner lead of a TAB tape to each other by heating and thermocompression bonding them uniformly in location. CONSTITUTION:There are provided a columnar conductive member 12 having at least one end being cylindrical and the other end being halved axially, a flat plate-shaved conductive block 13 which is welded across an opening of the cylinder and is united with the cylinder, and a plurality of through-holes 14 formed in the side wall of the cylindrical portion perpendicularly to the axial direction.
申请公布号 JPH06252222(A) 申请公布日期 1994.09.09
申请号 JP19930036395 申请日期 1993.02.25
申请人 NEC KANSAI LTD 发明人 TAZAKI SHUJI
分类号 H01L21/60;H01L21/603;(IPC1-7):H01L21/603 主分类号 H01L21/60
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