摘要 |
PURPOSE:To provide a pulsed heating tool for thermocompression bonding by an inner lead bonder for bonding a bump electrode of a semiconductor pellet and an inner lead of a TAB tape to each other by heating and thermocompression bonding them uniformly in location. CONSTITUTION:There are provided a columnar conductive member 12 having at least one end being cylindrical and the other end being halved axially, a flat plate-shaved conductive block 13 which is welded across an opening of the cylinder and is united with the cylinder, and a plurality of through-holes 14 formed in the side wall of the cylindrical portion perpendicularly to the axial direction. |