ISOLATION OF RELATED ELEMENTS, PARTICULARLY ELECTRONIC ELEMENTS, IN THE DEVICE BODY

摘要

PROBLEM TO BE SOLVED: To provide a method of separating related elements in the device body without generation of cracks. SOLUTION: Elements such as electronic elements 2 in the device body 1 may be isolated by removing isolation regions 3 between these elements by the etching process. In the region of the body 1 to be reduced in the thickness, a retardation layer 4 having an aperture 5 in the isolation region 3 is provided to retard the material removing process and thereby the isolation region 3 is removed for the purpose of isolation as shown in Figs (a) and (b).