发明名称 Multilayer electronic component method of manufacturing the same and method of measuring characteristics thereof
摘要 In order to provide a multilayer electronic component (10) which can reduce arrangement pitches for external electrodes (12), via holes (19) filled up with conductive materials (18) are provided in a mother laminate (14), which is obtained by stacking a plurality of insulating sheets (16, 17) with interposition of conductor films (23, 24), in positions parted by cutting. The conductive materials (18) define external electrodes (12) of individual multilayer electronic components (10) which are obtained by cutting the mother laminate (14). No specific step is required for forming the external electrodes (12), and characteristics of each multilayer electronic component (10) can be efficiently measured in the state of the mother laminate (14). <IMAGE>
申请公布号 SG48955(A1) 申请公布日期 1998.05.18
申请号 SG19960004107 申请日期 1993.07.23
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KUBOTA KENJI;SAKAI NORIO;KAWABATA SHOICHI
分类号 H01G2/06;H01G4/232;H01L21/66;H01L23/10;H01L23/498;H01L23/58;H05K1/03;H05K1/09;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H01G4/232 主分类号 H01G2/06
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