发明名称 ELECTRONIC COMPONENT
摘要 An electronic component is provided to mitigate a stress applied to a bonded part with a substrate even when a thermal shock is applied due to possible to reduce a crack generated from the bonded part. An electronic component, that is laminated ceramic condenser(1) includes a body(ceramic body)(10) and a pair of external electrodes(20) formed at lateral sides of the body(10). The body(10) is configured such that dielectric layers(12) and internal electrodes(14) are alternately laminated to arrange the dielectric layers(12) outsides thereof. Since the adjacent dielectric layers(12) are integrally formed with each other, boundaries between the adjacent dielectric layers(12) cannot be substantially seen. The internal electrodes(14) are installed such that only one-side ends are exposed to an end surface where the external electrodes(20) of the body(10) are formed. The plural internal electrodes(12) are arranged in the body(10) to be alternately exposed to the end surface facing the body(10) in approximately parallel to each other.
申请公布号 KR20070089608(A) 申请公布日期 2007.08.31
申请号 KR20070019014 申请日期 2007.02.26
申请人 TDK CORPORATION 发明人 KOMATSU TAKASHI;TANABE KOUJI
分类号 H01G4/005;H01G4/12 主分类号 H01G4/005
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