SOLDER ALLOY AND PROCESS FOR PRODUCING THE SAME

摘要

A lead-free solder alloy is provided which has bonding reliability and eliminates the problem that conventional lead-free solder alloys are inferior in bond strength to lead-containing solder alloys. The solder alloy is characterized by being obtained through the addition of a given amount of carbon to a lead-free solder material in an environment having a high temperature in the range of 800-1,200°C. Also provided is a process for producing a solder alloy characterized by comprising: a melting step in which a metal-melting furnace for high temperatures into which a lead-free solder material has been charged is heated to a high-temperature environment in the range of 800-1,200°C to melt the lead-free solder material; a carbon addition step in which a given amount of carbon is added to the lead-free solder material which has been melted in the melting step and is held in the high-temperature environment (melted lead-free solder material); a stirring step in which the melted lead-free solder material and the carbon are stirred; and a cooling step in which the resultant mixture obtained in the stirring step by stirring the melted lead-free solder material and the carbon is poured into a casting mold to cool and solidify the mixture.