| 摘要 |
PROBLEM TO BE SOLVED: To provide a controller in a polishing equipment for semiconductor wafers in which a highly accurate polishing is made possible, reflecting such polishing conditions as the updated situation of the surface of a polishing nonwoven fabric and the updated components and temperature of a polishing liquid on the polishing. SOLUTION: This equipment has a polishing-time calculating unit 3, a polishing-time distributing unit 4, and a polishing controlling portion 5. When polishing semiconductor wafers initially, inputting a desired value MT of the film thickness of the wafer and an initial polishing time T0 from an inputting device 2, the first semiconductor wafer is polished only during the time T0 in the polishing portion of the polishing equipment. Thereafter, from the time TO, a measurement value M1 of the pre-polishing film thickness and a measurement value MF1 of the post-polishing film thickness, an optimum polishing time T1 which is applied to each of the second wafer to the wafer with a predetermined sheet number is calculated to polish each semiconductor wafer during the foregoing optimum time T1 . Thereafter, whenever the polishing is completed, the optimum polishing time which is applied to each of the wafer with a specific sheet number to the wafer with a new predetermined sheet number is calculated in succession to polish each semiconductor wafer. |
