发明名称 RIBBON BONDING DEVICE
摘要 PURPOSE:To allow ribbon bonding and ribbon-like thin metal bonding onto fine portions to be performed easily and accurately by irradiating a laser beam onto a portion of ribbon like metal to be bonded through a columnar lens which is brought into contact with the portion of ribbon-like metal to be bonded. CONSTITUTION:A board 1 is fixed on an X-Y table 10 and a bonder head 12 is lowered to a position where a columnar lens 14 is focused on a ribbon-like metal 3 of the board 1. When a laser beam is injected from a laser oscillating unit under this condition, the laser beam is irradiated onto the ribbon-like metal 3 from the columnar lens 14 through a laser optical path within a sleeve 13 by an optical fiber 15. Accordingly, the ribbon-like metal 3 is bonded onto a conductor pattern 2 by heating. At the time of such a bonding by heating, the columnar lens 14 presses the ribbon-like metal 3 by a small force derived from the lowering of the bonder head 12, and this allows the ribbon-like metal 3 to be subjected to thermocompression bonding with respect to the conductor pattern 2, whereby the ribbon-like metal 3 can be bonded accurately.
申请公布号 JPH01232793(A) 申请公布日期 1989.09.18
申请号 JP19880058225 申请日期 1988.03.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 MATSUMOTO KAYO;FUJIWARA TAKEJI
分类号 B23K26/00;B23K26/06;B23K26/20;H01R43/02;H05K3/32 主分类号 B23K26/00
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