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发明名称
MOUNTING STRUCTURE OF HYBRID IC SUBSTRATE
摘要
申请公布号
JPH0685164(A)
申请公布日期
1994.03.25
申请号
JP19920260814
申请日期
1992.09.02
申请人
SONY CORP
发明人
ITOU MUTSUSADA
分类号
H01L23/32;H01L23/50;H01L25/10;H01L25/18;H05K1/14;H05K3/32;H05K3/36;(IPC1-7):H01L25/10
主分类号
H01L23/32
代理机构
代理人
主权项
地址
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