| 摘要 |
PROBLEM TO BE SOLVED: To enhance conductivity and decrease conductivity change under high humidity in spite of using low price metal powder by applying the specified amount of a specific imidazole silane compound to metal powder, then dispersing them in an organic solvent containing thermosetting resin. SOLUTION: In conductive paste containing flaky or dendritic metal powder, as thermosetting resin, phenolic resin and/or epoxy resin are/is used. An imidazole silane compound represented by the specified general formula is applied 0.0001-5wt.% based on the weight of the metal powder to the surface of metal powder containing copper powder or silver plated copper powder having a mean particle diameter of 30μm or less, then they are dispersed in an organic solvent containing thermosetting resin. The imidazole silane compound coated on the metal powder forms a chelate compound on the surface of the metal powder to disturb the contact of copper with oxygen, and oxidation of copper is prevented. Therefore, conductivity is enhanced, conductivity change under high humidity is decreased, and since copper powder is used, cost is reduced.
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