发明名称 CHIP MOUNTER
摘要 PROBLEM TO BE SOLVED: To obtain a chip mounter by which an SAW device can be formed fully automatically; with good accuracy and at good yield by a method wherein a carrier which holds a plurality of enclosures without a mounted chip component is fed and driven intermittently on a conveyance passage which guides and holds the carrier, a chip component is mounted inside every enclosure and the carrier is collected sequentially. SOLUTION: A chip mounter ass is provided with a carrier feed device 17 by which a carrier 1 holding many enclosures 1 without a mounted chip 7 is fed on a carrier conveyance passage 19 holding the carrier 11, with a carrier conveyance device 20 by which the carrier 11 is fed and driven intermittently on the conveyance passage 19, with a mounting device 22 by which the chip 7 is mounted inside every enclosure 1 held by the carrier 11 and with a carrier collection device 18 by which the carrier 11 with the mounted chip in every enclosure 1 is collected sequentially from the conveyance passage 19. Thereby, chips in large quantities can be mounted automatically and continuously.
申请公布号 JPH09181145(A) 申请公布日期 1997.07.11
申请号 JP19950339223 申请日期 1995.12.26
申请人 TOSHIBA CORP 发明人 OBATA MASANORI;MUSHA HITOSHI;TSUCHIYA HITOSHI;TANAKA KENGO
分类号 H01L21/677;H01L21/52;H01L21/68;H03H3/08;(IPC1-7):H01L21/68 主分类号 H01L21/677
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