发明名称 PATTERN FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a pattern formation method wherein stencil form is surely formed and lift-off process and peeling of substrates are easily performed, related to a method for forming geometric metal film on a substrate by lift-off method. SOLUTION: A lower layer resist film 13 is formed on a substrate 1, ultraviolet ray 4 is projected to raise development speed or the tower layer resist film 13, and then an upper layer resist film 14 is formed and the ultraviolet ray 4 is projected through a photo-mask 3, after that, the resist films 13 and 14 are developed in a developing liquid to form a stencil form 6.
申请公布号 JPH11204414(A) 申请公布日期 1999.07.30
申请号 JP19980007523 申请日期 1998.01.19
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 NOGUCHI KAZUTO;ODAKA ISAMU
分类号 G03F7/095;G03F7/26;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/095
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