DIE MATERIAL AND DIE FOR PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To execute a standardization of working, the shortening of processes and the stabilization of quality by integrally joining two kinds or more of metallic materials having different hardness with an adhesive to produce a composite material. SOLUTION: A metallic material 1 having high hardness is integrally joined to a metallic material 2 having a little low hardness with an adhesive. An integrally joined composite material is pressurized and dried to harden it. Through-holes are perforated in four to ten places of the joined and hardened composite material. A metallic pin 5 is driven into the each through-hole and its upper and lower ends are caulked. The composite material is formed in such a manner. Also, the metallic material 1 having high hardness is joined to both surfaces of the metallic material having a little low hardness with the adhesive 3 to form a sandwich structure of three layers or more. An adhesive incorporating a conductive substance is used as the adhesive 3. A die for a printing circuit board is composed using a die material wherein two kinds or more of metallic materials having different hardness are integrally joined with the adhesive.