| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the damage of a connection part owing to a thermal expansion difference by means of a temperature change, by arranging solder ball electrodes at the back of a package in a grid form, and loading and electrically connecting solder balls on/to a printed board by melting/solidifying the solder balls fitted to the solder ball electrodes. SOLUTION: A wiring tape 3 is adhered to a semiconductor chip 2 as the package. A solder ball electrodes 31 being flip chip mounting electrodes are formed in the grid form on the side of the back of the wiring tape 3. Wire bonding electrodes 33 are electrically connected to the solder ball electrodes 31 by melting and solidifying solder balls 32 fitted on the respective solder ball electrode 31 in the side edge part of the back of the wiring tape 3. Thus, the damage to the connection part owing to the thermal expansion difference by the temperature change can be prevented, and fine soldering, wire bonding and flip chip mounting can be realized.</p> |
