| 摘要 |
PURPOSE:To prevent the breakage of a semiconductor device, etc., and the generation of a defect by preheating or slow cooling a molten solder by using two kinds of vapor phases of different b.p. CONSTITUTION:The solvent 5 mixing the inert 1st solvent having the b.p. of >=the m.p. of a solder and the 2nd solvent having the b.p. of <= the m.p. of a solder are input to a solder melting part main body 1 and heated by the heater 6 provided at the lower part. When it is heated more than the b.p. of the 2nd solvent, the 2nd solvent is vaporized and ascended to the upper part of the solder melting part 1 inside, descended by being liquefied by the cooling device 7 and 8 respectively provided of the inlet side and outlet side conveyor 2, 3, heated this time by the heater 9 and 10 respectively provided of the inlet side and outlet side conveyor 2, 3, ascended again by being liquefied and 2nd vapor phase 12 and 13 are formed. When it attains more than the b.p. of the 1st solvent, the 1st solvent is ascended by being vaporized and a 1st vapor phase 11 is formed similar to before. It is then preheated by the 2nd vapor phase 12 by operating a cyclic chain conveyor, the solder melting is executed by the 1st vapor phase 11 the solder is slowly cooled by the 2nd vapor phase 13, and the soldering is completed. |
