发明名称 Condenser microphone package
摘要 A condenser microphone package includes: a condenser microphone unit including a diaphragm and a back plate; a printed circuit board; a conductive connector sandwiched between and cooperating with the condenser microphone unit and the printed circuit board to form a stack; and a metal can encasing the stack and having a first end wall that is formed with a plurality of sound holes, and that abuts against the condenser microphone unit, and a second end wall that is disposed opposite to the first end wall, that abuts against the printed circuit board, and that cooperates with the first end wall to press the printed circuit board toward the condenser microphone unit.
申请公布号 US2008232630(A1) 申请公布日期 2008.09.25
申请号 US20070725737 申请日期 2007.03.19
申请人 NATIONAL CHUNG-HSING UNIVERSITY 发明人 HORNG RAY-HUA;CHANG CHAO-CHIH;TSAI JEAN-YIH;HU GU-YU;JING YU-NING
分类号 H04R17/02 主分类号 H04R17/02
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