| 摘要 |
PURPOSE: To array a plurality of bumps in an integrated circuit on mutually parallel straight lines, and to flow a sealing resin forming a linear flow path, in which there is no bump, smoothly and easily. CONSTITUTION: Bumps 12 are placed so as to be conformed at the corresponding places of a wiring patter 14. The whole is inserted into a reflow furnace while keeping the state, and heated, thus melting solder 15, then conducting soldering by a reflow system. A sealing resin 16 is infected into a clearance between a wiring board 13 in the wiring board 13, on which a bare chip 11 is evaporated, and the bare chip 11 by a dispenser, etc., along a plurality of the bumps 12 disposed onto parallel straight lines. Consequently, the sealing resin 16 is filled in the direction of the arrow. The sealing resin 16 is cured by a method such as afterwards conducted heating, ultraviolet irradiation or the like, thus protecting connecting sections, etc. |
