| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition capable of achieving a low moisture absorption exceeding that of conventional arts, and capable of provid ing a package having extremely superior crack resistance compared to a conven tional hardened product especially in a semiconductor sealing material use. SOLUTION: This resin composition consists essentially of a phosphine oxide compound of the general formula (R1 to R6 are each hydrogen atom, a 1-10C alkyl group or a 6-10C aryl or aralkyl group) as a hardening accelerator, and comprises an epoxy resin obtained from phenol aralkyl resins, and two or more functional ester-containing compound or ester containing resins, having 10-100 mol% hydroxy group esterified by an aliphatic acyl group as a curing agent.
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