| 摘要 |
PURPOSE: A fabrication method of a self-alignment vibration panel is provided to prevent an over-etch problem and the increase of a size of a micro-structure. CONSTITUTION: The first conductive layer(42) is formed on a substrate(41). Then, the first conductive layer(42) is firstly patterned. A sacrificial layer is formed on the entire surface of the resultant structure. A second conductive layer(44) is formed on the sacrificial layer. Then, the second conductive layer(44) is secondly patterned. A vibration panel(45) is formed on the second conductive layer(44). Then, the sacrificial layer is removed. At this point, the first and second conductive layers(42,44) are made of a material capable of being plated, such as Au, Cu, Al or Pt. At this point, the first and second conductive layers(42,44) are patterned by a photolithography.
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