| 摘要 |
A line flip chip package and a manufacturing method thereof are provided to improve connectivity between a semiconductor die and a substrate a wire terminal without a bumping process. A line flip chip package includes a semiconductor die(110) having a plurality of bonding pads(112), a substrate(120) facing the bonding pads of the semiconductor die and having a plurality of wiring patterns(122,123) formed on a surface thereof, and a plurality of wire terminals(130) for connecting the bonding pads of the semiconductor die with the wiring patterns of the substrate. The wire terminals are connected with the wiring patterns of the substrate by using solder paste. A plurality of insulating spacers(140) are inserted between the semiconductor die and the substrate. One surface of the insulating space is attached directly to a surface of the semiconductor die. The other surface of the insulating space is attached to the substrate by using an adhesive. |
