发明名称 |
Switching or control apparatus |
摘要 |
<p>The support surface is connected by through-contacts with components (19) to be cooled on the opposite side of the PCB (12). These have heat transfer surfaces. The components are aligned with cooling surface zones (28), so that dissipated heat is removed by the support surface. Through-contacting and local heat transfer take place at right angles to the plane of the PCB.</p> |
申请公布号 |
EP1289011(B1) |
申请公布日期 |
2007.11.28 |
申请号 |
EP20020016073 |
申请日期 |
2002.07.19 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
BECKENBAUER, DIETRICH;MAYER, FRANK;SCHIEFER, PETER |
分类号 |
H01L23/36;H01L23/367;H05K1/02;H05K5/00;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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