SEMICONDUCTOR PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

摘要

A method for manufacturing semiconductor packages is provided. The upper surface of a substrate has a plurality of slots and surface mount devices are positioned across the slots. In this circumstance, the space below the surface mount devices can be filled up with sealant as a result of the arrangement of the slots. This can avoid the occurrence of the melted solders to bridge to each other and of the tomb stone effect of the surface mount devices.