| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive and highly reliable IC card or the like for both contact/non-contact, and a communication module used for the IC card or the like. SOLUTION: The communication module 20 is provided with a substrate 22, a contact terminal 24 formed on the upper surface of the substrate 22, an antenna 60 formed on the lower surface and an IC chip 82 attached to the lower surface. The antenna 60 is formed on the lower surface of the substrate 22 by etching or printing or the like. When one communication module loaded to the same substrate 22 is prepared, just by embedding it to a core member 30 and clamping it by surface layer materials 28 and 26, the IC card is completed. Thus, the assembly work of the IC card is simplified. As a result, the assembly cost is lowered. Also, the need of a wire for connecting the antenna 60 and the substrate 22 is eliminated. Thus, function defects by the disconnection of the wire due to deformation or the like added to the IC card are not generated. |
