发明名称 Kontaktlose IC-Karte sowie deren Herstellungs- und Prüfverfahren
摘要 A non-contact IC card comprising a circuit board (10), an electronic circuit (9) mounted on the circuit board (10) and having a plurality of functions, a package (14) sealing the electronic circuit (9), a plurality of testing wire conductors (8) disposed on the circuit board (10) and connected at one end to the electronic circuit (9) and exposed at the other end from the package (14) for individually testing the functions of the electronic circuit (9). Each of the other end of the testing wire conductors (8) comprises a testing pad (11) disposed on the circuit board (10). The non-contact IC card may comprise insulating means electrically insulating the other end of the testing wire conductors or the testing pads (11) from outside. The present invention also resides in methods for manufacturing and testing the same. <IMAGE>
申请公布号 DE69314867(D1) 申请公布日期 1997.12.04
申请号 DE1993614867 申请日期 1993.07.29
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 OHNO, HISASHI, C/O MITSUBISHI DENKI K.K., ITAMI-SHI, HYOGO 664, JP
分类号 B42D15/10;G01R31/28;G06K19/07;G06K19/077;H01L21/66;H01L23/28;H01L23/50;H01L23/58;H05K1/02;H05K1/11;H05K3/28;(IPC1-7):H01L23/538;H01L23/498 主分类号 B42D15/10
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