| 摘要 |
PURPOSE:To high accurately perform positioning by intentionally weakening relatively large generated vacuum suction force by the time immediately before the peripheral edge part of a wafer is adapted to a stopper surface and generating a condition that the displacement is generated between the wafer and its supporting part by external force acting in a reverse direction to the advancing direction. CONSTITUTION:Before a transfer feed arm 30 just presses an advancing direction peripheral edge part 12 of a wafer 10 to a stopper surface 81, vacuum suction force is weakened to the suction force in a level such as generating the displacement between the wafer 10 and its supporting part 31. And holding that condition being left as it is, even after the point end peripheral edge part 12 of the wafer is adapted to the stopper surface 81, the transfer feed arm 30 is advanced further to the front by a suitable distance. Consequently, the wafer 10, effectively utilizing this displacement, can be pressed to the stopper surface 81, while in this condition, the transfer feed arm 30 is appropriately stopped, and when the vacuum suction force is stopped, high accurate positioning can be performed suppressing undesired waving and backlash or the like to a minimum limit. |
