发明名称 WAFER CLEANNING APPARATUS
摘要 According to the present invention, disclosed is a substrate cleaning device which comprises: a nozzle unit with a plurality of nozzles which spray different cleaning solutions toward a substrate; and a driving unit configured to drive the plurality of nozzles to selectively face the substrate. The driving unit comprises: a driving unit interfering in any one of the plurality of nozzles to transfer a driving force; and a fixing unit configured to fix a gesture of a non-driving nozzle which is not connected to the driving unit among the plurality of nozzles. According to the configuration, any selected one of the plurality of nozzles can be driven to contribute to cleaning efficiency improvement even in a narrow space.
申请公布号 KR20160080694(A) 申请公布日期 2016.07.08
申请号 KR20140193418 申请日期 2014.12.30
申请人 K.C.TECH CO., LTD. 发明人 PARK, MI KYOUNG
分类号 H01L21/02;H01L21/302 主分类号 H01L21/02
代理机构 代理人
主权项
地址