| 摘要 |
<p>PURPOSE:To load a larger IC chip to a package having predetermined size by making sealing surfaces in the edge sides of a pair of opposed two sides lower than the highest reaching point in the direction of the height of a bonding wire connecting a pad section for the IC chip and an inner lead in the periphery of a case and making sealing surfaces in the edge sides of a pair of other opposed two sides higher than it. CONSTITUTION:An integrated circuit chip 10 is fixed to the central recessed section of a package case 1, and pad sections in the periphery of the chip 10 and inner leads 2 formed in response to the pads and shaped onto a base in the periphery of the case 1 are connected by curvedly bent bonding wires 3. Sidewalls 4 higher than the height of the highest reaching point of the bonding wires 3 are shaped an the edge sections of the oppositely faced short sides of the rectangular case 1. On the other hand, an inner-lead forming base section in the same height as pad surfaces in the chip 10 is formed as it is at the edge sections of the oppositely faced long sides of the case 1. Accordingly, integrated circuit chips in large breadth can be loaded onto packages in the same size.</p> |
