| 摘要 |
<p>PURPOSE:To get an epoxy resin composition for sealing an optical semiconductor, which is excellent in transparency, heat resistance, and has quick hardening property, by using a hardener, which contains tetrabasic acid anhydride. CONSTITUTION:As epoxy resin, there is no special restriction so long as it is a thing little in coloring. For a hardener, as an alicyclic dibasic acid anhydride, hexahydrophthalic acid anhydride or methylhexahydropthalic acid anhydride is cited, and as alicyclic tetrabasic acid anhydride, 5-(2,5-dioxotetrahydro-3- furanyl)-3-cyclohexene-1,2-dicaboxylic acid anhydride is cited. For the mixture ratio of the mixed hardener consisting of these dibasic acid anhydride and tetrabasic acid anhydride, it is to be desired that the quantity of mixed tetrabasic acid anhydride should be not more than 50wt.% of the whole of the hardener. It is desirable that the equivalent ratio of epoxy resin to anhydride hardener should be 0.8-1.1, and the hardening accelerator is not restricted especially, but it will do to put the quantity of addition at 0.1-5wt.% of the sum total of the epoxy resin and the hardener.</p> |
