发明名称 Base-pad for a polishing pad
摘要 The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.
申请公布号 KR100767429(B1) 申请公布日期 2007.10.17
申请号 KR20027017864 申请日期 2001.06.29
申请人 发明人
分类号 B24D11/00;B24B37/22;B24B37/24;B24D11/02;B24D13/12;B24D13/14;H01L21/304 主分类号 B24D11/00
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