发明名称 ILLUMINATION APPARATUS
摘要 An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.
申请公布号 US2016209023(A1) 申请公布日期 2016.07.21
申请号 US201514691594 申请日期 2015.04.21
申请人 Subtron Technology Co., Ltd. 发明人 Tseng Tzyy-Jang;Shen Tzu-Shih
分类号 F21V31/00;F21V29/85;F21V29/76 主分类号 F21V31/00
代理机构 代理人
主权项 1. An illumination apparatus, comprising: a thermal conductivity substrate having an upper surface; a package carrier disposed on the upper surface of the thermal conductivity substrate and having an opening, the opening exposing a portion of the upper surface; at least one light emitting element disposed on the upper surface of the thermal conductivity substrate exposed by the opening of the package carrier; at least one bonding wire electrically connecting the light emitting element to the package carrier; a light transmission cap disposed above the thermal conductivity substrate, wherein the light emitting element and the package carrier are located between the light transmission cap and the thermal conductivity substrate; a first seal ring disposed between the light transmission cap and the package carrier; and a second seal ring disposed between the package carrier and the thermal conductivity substrate, wherein the thermal conductivity substrate, the light transmission cap, the first seal ring, the second seal ring and the package carrier encapsulate the light emitting element.
地址 Hsinchu County TW