Semiconductor device

摘要

A semiconductor device including a semiconductor chip, a first electrode pad and second electrode pad included on one surface of the semiconductor chip, a first conductive post joined by a joining material to the first electrode pad, a plurality of second conductive posts joined by a joining material to the second electrode pad, and a printed substrate, disposed opposing the one surface of the semiconductor chip, on which is formed an electrical circuit to which the first conductive post and second conductive posts are connected. The second conductive posts on the side near the first conductive post are arrayed avoiding a short-circuit prevention region at a distance such that the joining material of the first conductive post and the joining material of the second conductive posts do not link.

主权项

1. A semiconductor device, comprising:
a semiconductor chip; a first electrode pad and second electrode pad included on the semiconductor chip; a first conductive post connected to the first electrode pad by a joining material; a plurality of second conductive posts connected to the second electrode pad by a joining material; and a printed substrate including an electrical circuit to which the first conductive post and second conductive posts are connected, wherein the first electrode pad is disposed opposing an intermediate portion of an edge of the second electrode pad, and the plurality of second conductive posts are arrayed outside a short-circuit prevention region positioned between two of the second conductive posts arrayed on a side of the second electrode pad near the first conductive post, the short-circuit prevention region including a point of intersection of a first imaginary line bisecting the two of the second conductive posts and a second imaginary line, the second imaginary line being perpendicular to the first imagery line and bisecting the first conductive post, and the short-circuit prevention region being free of any second conductive posts.