发明名称 |
DIE-STAMPED CIRCUIT BOARD ASSEMBLY FOR PHOTOFLASH DEVICES AND METHOD OF MAKING |
摘要 |
<p>A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without serving the switch material.</p> |
申请公布号 |
EP0038422(B1) |
申请公布日期 |
1984.06.27 |
申请号 |
EP19810101953 |
申请日期 |
1981.03.16 |
申请人 |
GTE PRODUCTS CORPORATION |
发明人 |
BROADT, DAVID R.;BROWER, BOYD G.;SHAFFER, JOHN W. |
分类号 |
F21K5/04;G03B15/04;H01H37/76;H05K3/32;(IPC1-7):03B15/04 |
主分类号 |
F21K5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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