发明名称 DIE-STAMPED CIRCUIT BOARD ASSEMBLY FOR PHOTOFLASH DEVICES AND METHOD OF MAKING
摘要 <p>A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without serving the switch material.</p>
申请公布号 EP0038422(B1) 申请公布日期 1984.06.27
申请号 EP19810101953 申请日期 1981.03.16
申请人 GTE PRODUCTS CORPORATION 发明人 BROADT, DAVID R.;BROWER, BOYD G.;SHAFFER, JOHN W.
分类号 F21K5/04;G03B15/04;H01H37/76;H05K3/32;(IPC1-7):03B15/04 主分类号 F21K5/04
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