| 摘要 |
PURPOSE:To obtain the conductor pattern having no recesses and projections on their edge part by a method wherein a resin film is formed on a vacuum- deposited conductor film, and a dry etching is performed using the resist pattern formed on the resin film as a mask. CONSTITUTION:A resin film 12 is formed on the conductor film 11, which is vapor-deposited on a substrate 10, by spin-coating resin. A resist pattern 13 is formed thereon by coating photoresist. Using said resist pattern 13 as a mask, a conductor pattern 14 is formed by performing a dry etching on the resin film 12 and the conductive film 11. The conductor film 11 is flattened with the resin film 12 even when there are recesses and projections on the conductive film 11, and no recesses and projections are generated on the pattern edge. The resist pattern 3 is removed after etching, but the resin film 12 may be left as a part of an interlayer insulating film.
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