发明名称 WIRE BONDER
摘要 <p>PURPOSE:To prevent a fine metal wire from being bent and hung at the time of wire bonding. CONSTITUTION:While a fine metal wire (28) is clamped with a first clamper (23) closed, the first clamper (23) is raised with respect to a capillary chip (21) by a first clamper vertically moving mechanism (35), whereby an excessive fine metal wire (28) which has been fed below the capillary chip (21) is pulled back, and then the capillary chip (21) is lowered by a horn vertically moving mechanism (25) to bond the fine metal wire (28).</p>
申请公布号 JPH04247631(A) 申请公布日期 1992.09.03
申请号 JP19910031431 申请日期 1991.02.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWASHITA HIROSHI
分类号 H01L21/60;B23K20/00 主分类号 H01L21/60
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